The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2023
Filed:
Aug. 21, 2021
Towa Corporation, Kyoto, JP;
Yusuke Yoshida, Kyoto, JP;
Yohei Onishi, Kyoto, JP;
TOWA CORPORATION, Kyoto, JP;
Abstract
The present invention provides a resin leakage prevention memberfor use in a molding die, wherein the molding dieincludes a lower dieand an upper die, the lower diehas a side memberand a bottom member, a space surrounded by the side memberand the bottom memberforms a cavity, the cavityis configured to accommodate a resin material, the side memberis configured to move relatively vertical to the bottom member, and the resin leakage prevention memberis disposed on a peripheral portion of an upper surface of the bottom memberand along an inner peripheral surface of the side member, thereby sealing a gap between the side memberand the bottom memberand preventing a resin from leaking from the cavityinto the gap.