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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11712745 B1

PDFFull Text
Date of Patent:
Aug. 01, 2023

Filed:

Jan. 25, 2022

Semiconductor substrate support with multiple electrodes and method for making same

Applicant:

Watlow Electric Manufacturing Company, St. Louis, MO (US);

Inventors:

Michael Parker, Brentwood, CA (US);

Alfred Grant Elliot, Palo Alto, CA (US);

Brent Donald Alfred Elliot, Cupertino, CA (US);

Frank Balma, Los Gatos, CA (US);

Richard Erich Schuster, Milpitas, CA (US);

Dennis George Rex, Williams, OR (US);

Alexander Veytser, Moutain View, CA (US);

Assignee:

WATLOW ELECTRIC MANUFACTURING COMPANY, St. Louis, MO (US);

Attorney:

Burris Law, PLLC

Primary Examiner:

Kiley S Stoner

Int. Cl.
CPC ...
B23K 1/00 (2006.01); B32B 18/00 (2006.01); B32B 9/00 (2006.01); B32B 15/20 (2006.01); C04B 37/00 (2006.01); B23K 1/19 (2006.01); B23K 1/20 (2006.01); B23K 35/28 (2006.01); B23K 35/00 (2006.01); C04B 35/645 (2006.01); B32B 9/04 (2006.01); F16B 9/00 (2006.01); B32B 3/30 (2006.01); B32B 7/14 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H05B 1/00 (2006.01); H01L 21/687 (2006.01); B23K 103/10 (2006.01);
U.S. Cl.
CPC ...
B23K 1/0008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 1/20 (2013.01); B23K 35/005 (2013.01); B23K 35/286 (2013.01); B32B 3/30 (2013.01); B32B 7/14 (2013.01); B32B 9/005 (2013.01); B32B 9/04 (2013.01); B32B 9/041 (2013.01); B32B 15/20 (2013.01); B32B 18/00 (2013.01); C04B 35/645 (2013.01); C04B 37/001 (2013.01); C04B 37/006 (2013.01); F16B 9/00 (2013.01); H01L 21/67103 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); H05B 1/00 (2013.01); B23K 2103/10 (2018.08); C04B 2235/6562 (2013.01); C04B 2235/6565 (2013.01); C04B 2235/6567 (2013.01); C04B 2235/6581 (2013.01); C04B 2235/6582 (2013.01); C04B 2235/945 (2013.01); C04B 2237/121 (2013.01); C04B 2237/122 (2013.01); C04B 2237/126 (2013.01); C04B 2237/127 (2013.01); C04B 2237/34 (2013.01); C04B 2237/343 (2013.01); C04B 2237/348 (2013.01); C04B 2237/36 (2013.01); C04B 2237/365 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/592 (2013.01); C04B 2237/61 (2013.01); C04B 2237/64 (2013.01); C04B 2237/66 (2013.01); C04B 2237/68 (2013.01); C04B 2237/704 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01); C04B 2237/76 (2013.01); C04B 2237/765 (2013.01); C04B 2237/80 (2013.01); C04B 2237/84 (2013.01); Y10T 403/46 (2015.01); Y10T 428/31504 (2015.04); Y10T 428/31678 (2015.04);
Abstract

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770 C to 1200 C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

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