The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Oct. 14, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Frank Singer, Regenstauf, DE;

Martin Gruber, Schwandorf, DE;

Thorsten Meyer, Regensburg, DE;

Thorsten Scharf, Lappersdorf, DE;

Peter Strobel, Regensburg, DE;

Stefan Woetzel, Erfurt, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/54 (2006.01); H01L 23/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/54 (2013.01); H01L 21/56 (2013.01); H01L 23/16 (2013.01); H01L 23/31 (2013.01); H01L 23/49541 (2013.01);
Abstract

A package is disclosed. In one example, the package comprises a substrate having at least one first recess on a front side and at least one second recess on a back side, wherein the substrate is separated into a plurality of separate substrate sections by the at least one first recess and the at least one second recess, an electronic component mounted on the front side of the substrate, and a single encapsulant filling at least part of the at least one first recess and at least part of the at least one second recess. The encapsulant fully circumferentially surrounds sidewalls of at least one of the substrate sections.


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