The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Jul. 08, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Taylor William Gaines, Chandler, AZ (US);
Ken Hackenberg, Plano, TX (US);
Elah Bozorg-Grayeli, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); F28F 3/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/40 (2013.01); F28F 3/10 (2013.01); H01L 21/4882 (2013.01); H01L 23/3675 (2013.01); F28F 2230/00 (2013.01);
Abstract
Embodiments may relate to a microelectronic package that includes an integrated heat spreader (IHS) coupled with a package substrate. The microelectronic package may further include a sealant material between the package substrate and the IHS. The sealant material may be formed of a material that cures when exposed to ultraviolet (UV) wavelengths. Other embodiments may be described or claimed.