The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Apr. 22, 2020
Applicants:

Gigaphoton Inc., Tochigi, JP;

Kyushu University, National University Corporation, Fukuoka, JP;

Inventors:

Hiroshi Ikenoue, Fukuoka, JP;

Osamu Wakabayashi, Oyama, JP;

Hiroaki Oizumi, Oyama, JP;

Akira Suwa, Oyama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/225 (2006.01); H01L 21/268 (2006.01); H01L 21/67 (2006.01); H01S 3/11 (2023.01); H01S 3/225 (2006.01); G02F 1/01 (2006.01); G02B 27/09 (2006.01); H01L 21/78 (2006.01); H01L 21/223 (2006.01); H01S 3/23 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); G02B 27/0955 (2013.01); G02F 1/0121 (2013.01); H01L 21/223 (2013.01); H01L 21/268 (2013.01); H01L 21/67092 (2013.01); H01L 21/67115 (2013.01); H01S 3/11 (2013.01); H01S 3/225 (2013.01); H01S 3/2308 (2013.01); G02F 2203/48 (2013.01);
Abstract

A laser irradiation method of irradiating, with a pulse laser beam, an irradiation object in which an impurity source film is formed on a semiconductor substrate includes: reading fluence per pulse of the pulse laser beam with which a rectangular irradiation region set on the irradiation object is irradiated and the number of irradiation pulses the irradiation region is irradiated, the fluence being equal to or larger than a threshold at or beyond which ablation potentially occurs to the impurity source film when the irradiation object is irradiated with pulses of the pulse laser beam in the irradiation pulse number and smaller than a threshold at or beyond which damage potentially occurs to the surface of the semiconductor substrate; calculating a scanning speed Vdx; and moving the irradiation object at the scanning speed Vdx relative to the irradiation region while irradiating the irradiation region with the pulse laser beam at the repetition frequency f.


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