The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2023

Filed:

Nov. 22, 2021
Applicant:

Changxin Memory Technologies, Inc., Hefei, CN;

Inventor:

Qinghua Han, Hefei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/308 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); H01L 29/66568 (2013.01); H01L 29/78 (2013.01);
Abstract

Embodiments of the present application provide a semiconductor structure and a manufacturing method thereof. The semiconductor structure manufacturing method includes: providing a base substrate and an array region, the array region being composed of strip structures arranged in parallel, the base substrate being made of a same material as the array region, and a thickness of the base substrate being greater than a thickness of the array region; etching the strip structure to form discrete first strip structures; base substrate providing a second mask layer, an opening pattern of the second mask layer exposing the to-be-etched region and the side plane, and a right angle being formed between an orthographic projection of the side plane and the opening pattern; form a first active region, the first active region having a mapping right angle corresponding to the right angle.


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