The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Feb. 13, 2018
Applicant:
Lintec Corporation, Tokyo, JP;
Inventor:
Isao Ichikawa, Tokyo, JP;
Assignee:
LINTEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/04 (2006.01); B22F 5/00 (2006.01); C09J 1/00 (2006.01); C09J 133/08 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); B22F 1/10 (2022.01); C08K 3/08 (2006.01);
U.S. Cl.
CPC ...
B22F 7/04 (2013.01); B22F 1/10 (2022.01); B22F 5/006 (2013.01); C09J 1/00 (2013.01); C09J 133/08 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); C08K 2003/0806 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/8384 (2013.01);
Abstract
This film-shaped firing material is a film-shaped firing material containing sinterable metal particles and a binder component, in which, when the average thickness of the portion of the film-shaped firing material excluding the edge portion is deemed 100%, the average thickness of the edge portion of the film-shaped firing material is at least 5% thicker than the average thickness of the portion of the film-shaped firing material excluding the edge portion.