The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Jul. 01, 2020
Applicant:

Ningbo Sunny Opotech Co., Ltd., Zhejiang, CN;

Inventors:

Mingzhu Wang, Ningbo, CN;

Bojie Zhao, Ningbo, CN;

Takehiko Tanaka, Ningbo, CN;

Feifan Chen, Ningbo, CN;

Qimin Mei, Ningbo, CN;

Liang Ding, Ningbo, CN;

Heng Jiang, Ningbo, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 23/57 (2023.01); H01L 27/146 (2006.01); H04N 13/239 (2018.01); H04N 23/45 (2023.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01);
U.S. Cl.
CPC ...
H04N 23/57 (2023.01); H01L 27/1469 (2013.01); H01L 27/14618 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H04N 13/239 (2018.05); H04N 23/45 (2023.01); H04N 23/51 (2023.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H01L 2224/48091 (2013.01); H04N 2213/001 (2013.01);
Abstract

A camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof is provided. The array camera module includes two or more camera lenses and a circuit unit. The circuit unit includes a circuit board portion for electrically connecting two or more photosensitive sensors of the array camera module, and a conjoined encapsulation portion integrally encapsulated on the circuit board portion. The camera lenses are respectively arranged along the photosensitive paths of the photosensitive sensors.


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