The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

May. 03, 2021
Applicant:

United Microelectronics Corp., Hsin-Chu, TW;

Inventors:

Yi-Fan Li, Tainan, TW;

Kuo-Chin Hung, Changhua County, TW;

Wen-Yi Teng, Kaohsiung, TW;

Ti-Bin Chen, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/417 (2006.01); H01L 29/49 (2006.01); H01L 29/423 (2006.01); H01L 21/311 (2006.01); H01L 29/66 (2006.01); H01L 29/161 (2006.01); H01L 29/78 (2006.01); H01L 29/165 (2006.01);
U.S. Cl.
CPC ...
H01L 29/41775 (2013.01); H01L 21/31116 (2013.01); H01L 29/161 (2013.01); H01L 29/42364 (2013.01); H01L 29/495 (2013.01); H01L 29/6653 (2013.01); H01L 29/66545 (2013.01); H01L 29/66575 (2013.01); H01L 29/7843 (2013.01); H01L 29/165 (2013.01); H01L 29/6656 (2013.01); H01L 29/7848 (2013.01);
Abstract

A first gate and a second gate are formed on a substrate with a gap between the first and second gates. The first gate has a first sidewall. The second gate has a second sidewall directly facing the first sidewall. A first sidewall spacer is disposed on the first sidewall. A second sidewall spacer is disposed on the second sidewall. A contact etch stop layer is deposited on the first and second gates and on the first and second sidewall spacers. The contact etch stop layer is subjected to a tilt-angle plasma etching process to trim a corner portion of the contact etch stop layer. An inter-layer dielectric layer is then deposited on the contact etch stop layer and into the gap.


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