The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Jan. 26, 2021
Applicant:

Stmicroelectronics, Inc., Coppell, TX (US);

Inventor:

John H. Zhang, Altamont, NY (US);

Assignee:

STMICROELECTRONICS, INC., Coppell, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/266 (2006.01); H01L 21/8238 (2006.01); H01L 21/84 (2006.01); H01L 23/528 (2006.01); H01L 27/092 (2006.01); H01L 29/06 (2006.01); H01L 29/66 (2006.01); H01L 29/161 (2006.01); H01L 29/78 (2006.01); H10B 10/00 (2023.01); H10B 20/00 (2023.01);
U.S. Cl.
CPC ...
H01L 27/1211 (2013.01); H01L 21/266 (2013.01); H01L 21/823814 (2013.01); H01L 21/823821 (2013.01); H01L 21/823828 (2013.01); H01L 21/823871 (2013.01); H01L 21/845 (2013.01); H01L 23/528 (2013.01); H01L 27/0924 (2013.01); H01L 29/0649 (2013.01); H01L 29/161 (2013.01); H01L 29/66795 (2013.01); H01L 29/7831 (2013.01); H01L 29/7838 (2013.01); H01L 29/7849 (2013.01); H10B 10/12 (2023.02); H10B 10/125 (2023.02); H10B 20/27 (2023.02); H01L 2924/0002 (2013.01);
Abstract

Single gate and dual gate FinFET devices suitable for use in an SRAM memory array have respective fins, source regions, and drain regions that are formed from portions of a single, contiguous layer on the semiconductor substrate, so that STI is unnecessary. Pairs of FinFETs can be configured as dependent-gate devices wherein adjacent channels are controlled by a common gate, or as independent-gate devices wherein one channel is controlled by two gates. Metal interconnects coupling a plurality of the FinFET devices are made of a same material as the gate electrodes. Such structural and material commonalities help to reduce costs of manufacturing high-density memory arrays.


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