The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

May. 17, 2021
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Yi Zhou, Fremont, CA (US);

Xinyue Chen, Sunnyvale, CA (US);

Mukul Khosla, San Jose, CA (US);

Yangchung Lee, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/44 (2006.01); C23C 16/455 (2006.01); C23C 16/40 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
C23C 16/4404 (2013.01); C23C 16/401 (2013.01); C23C 16/4405 (2013.01); C23C 16/45557 (2013.01); H01J 37/32477 (2013.01); H01J 37/32853 (2013.01); H01J 37/32862 (2013.01);
Abstract

Methods of semiconductor processing may include performing a first plasma treatment within a processing chamber to remove a first carbon-containing material. The methods may include performing a second plasma treatment within the processing chamber to remove a first silicon-containing material. The methods may include depositing a second silicon-containing material on surfaces of the processing chamber. The methods may include depositing a second carbon-containing material overlying the second silicon-containing material.


Find Patent Forward Citations

Loading…