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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11702578 B1

PDFFull Text
Date of Patent:
Jul. 18, 2023

Filed:

Jan. 13, 2020

Thermally conductive material, device with thermally conductive layer, composition for forming thermally conductive material, and disk-like liquid crystal compound

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Seiichi Hitomi, Ashigara-kami-gun, JP;

Keita Takahashi, Ashigara-kami-gun, JP;

Teruki Niori, Ashigara-kami-gun, JP;

Yuji Yoshida, Ashigara-kami-gun, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Jane L Stanley

Int. Cl.
CPC ...
C09K 5/14 (2006.01); C07C 43/23 (2006.01); C07C 69/88 (2006.01); C07C 223/06 (2006.01); C07C 261/02 (2006.01); C07C 321/26 (2006.01); C07C 323/52 (2006.01); C07D 271/10 (2006.01); C07D 303/12 (2006.01); C07D 307/89 (2006.01); C08G 59/24 (2006.01); C08G 59/40 (2006.01); C08G 59/42 (2006.01); C08G 59/50 (2006.01); C08G 59/62 (2006.01); C08G 65/40 (2006.01); C08J 5/18 (2006.01); C08K 3/38 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C07C 43/23 (2013.01); C07C 69/88 (2013.01); C07C 223/06 (2013.01); C07C 261/02 (2013.01); C07C 321/26 (2013.01); C07C 323/52 (2013.01); C07D 271/10 (2013.01); C07D 303/12 (2013.01); C07D 307/89 (2013.01); C08G 59/245 (2013.01); C08G 59/4014 (2013.01); C08G 59/423 (2013.01); C08G 59/4238 (2013.01); C08G 59/504 (2013.01); C08G 59/5046 (2013.01); C08G 59/621 (2013.01); C08G 65/40 (2013.01); C08J 5/18 (2013.01); C08K 3/38 (2013.01); C08J 2363/00 (2013.01); C08J 2371/10 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); H01L 23/3737 (2013.01);
Abstract

The present invention provides a thermally conductive material having excellent thermal conductivity. Furthermore, the present invention provides a device with a thermally conductive layer that has a thermally conductive layer containing the thermally conductive material and a composition for forming a thermally conductive material that is used for forming the thermally conductive material. The thermally conductive material according to an embodiment of the present invention contains a cured substance of a disk-like compound, which has one or more reactive functional groups selected from the group consisting of a hydroxyl group, a carboxylic acid group, a carboxylic acid anhydride group, an amino group, a cyanate ester group, and a thiol group, and a crosslinking compound which has a group reacting with the reactive functional groups.

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