The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Mar. 28, 2019
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/22 (2018.01); C09J 7/40 (2018.01); C09J 133/08 (2006.01); C09J 133/24 (2006.01); C09J 7/38 (2018.01); C09J 167/02 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C09J 7/22 (2018.01); C09J 7/385 (2018.01); C09J 7/40 (2018.01); C09J 133/08 (2013.01); C09J 133/24 (2013.01); C09J 167/02 (2013.01); H01L 21/6836 (2013.01); C09J 2203/326 (2013.01); C09J 2301/124 (2020.08); C09J 2301/208 (2020.08); C09J 2301/312 (2020.08); C09J 2301/416 (2020.08); C09J 2433/00 (2013.01); H01L 2221/68386 (2013.01);
Abstract
An adhesive sheet for temporary fixation which may have excellent heat resistance to exhibit a sufficient adhesive force even though it undergoes a high temperature process during a process of manufacturing a semiconductor device and may also exhibit a sufficient reduction of the adhesive force by photocuring during the step of peeling off, and a method of manufacturing a semiconductor device using the same, are provided.