The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 18, 2023
Filed:
Jan. 09, 2019
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Minsu Jeong, Daejeon, KR;
You Jin Kyung, Daejeon, KR;
Byung Ju Choi, Daejeon, KR;
Woo Jae Jeong, Daejeon, KR;
Kwang Joo Lee, Daejeon, KR;
Eunbyurl Cho, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); C08G 59/14 (2006.01); C08K 3/36 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); C08G 59/14 (2013.01); C08K 3/36 (2013.01); H01L 23/295 (2013.01); C08J 2363/00 (2013.01); C08K 2201/003 (2013.01);
Abstract
The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.