The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 18, 2023

Filed:

Jan. 30, 2017
Applicant:

Seurat Technologies, Inc., Mountain View, CA (US);

Inventors:

James A. DeMuth, Woburn, MA (US);

Erik Toomre, Los Altos, CA (US);

Martin Eberhard, Woodside, CA (US);

Assignee:

Seurat Technologies, Inc., Wilmington, MA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B29C 64/277 (2017.01); B22F 10/28 (2021.01); B22F 12/45 (2021.01); B22F 10/364 (2021.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 50/02 (2015.01); B23K 26/342 (2014.01); B23K 26/70 (2014.01); B28B 1/00 (2006.01); B28B 17/00 (2006.01); C21D 1/84 (2006.01); C21D 11/00 (2006.01); B22F 3/10 (2006.01); B22F 10/73 (2021.01); B22F 12/41 (2021.01); B22F 12/44 (2021.01); B22F 12/49 (2021.01);
U.S. Cl.
CPC ...
B29C 64/153 (2017.08); B22F 10/28 (2021.01); B22F 10/364 (2021.01); B22F 12/45 (2021.01); B23K 26/342 (2015.10); B23K 26/703 (2015.10); B28B 1/001 (2013.01); B28B 17/0081 (2013.01); B29C 64/277 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); C21D 1/84 (2013.01); C21D 11/005 (2013.01); B22F 3/1039 (2013.01); B22F 10/73 (2021.01); B22F 12/41 (2021.01); B22F 12/44 (2021.01); B22F 12/49 (2021.01); B22F 2999/00 (2013.01); C04B 2235/6026 (2013.01); C04B 2235/665 (2013.01); Y02P 10/25 (2015.11);
Abstract

An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. The two-dimensional energy patterning system may be used to control the rate of cooling experienced by each successive additive layer. Accordingly, the system may be used to heat treat the various additive layers.


Find Patent Forward Citations

Loading…