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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11699880 B1

PDFFull Text
Date of Patent:
Jul. 11, 2023

Filed:

May. 28, 2021

Backplane connector

Applicant:

Dongguan Luxshare Technologies Co., Ltd, Dongguan, CN;

Inventors:

Tao Song, Dongguan, CN;

Kun Liu, Dongguan, CN;

Rongzhe Guo, Dongguan, CN;

Chuanqi Gong, Dongguan, CN;

Xiaogang Liu, Dongguan, CN;

Ming Li, Dongguan, CN;

Assignee:

DONGGUAN LUXSHARE TECHNOLOGIES CO., LTD, Dongguan, CN;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Khiem M Nguyen

Int. Cl.
CPC ...
H01R 13/648 (2006.01); H01R 13/6471 (2011.01); H01R 13/40 (2006.01); H01R 13/6587 (2011.01); H01R 13/6591 (2011.01); H01R 13/514 (2006.01); H01R 13/518 (2006.01); H01R 12/72 (2011.01); H01R 13/6586 (2011.01); H01R 12/58 (2011.01); H05K 1/11 (2006.01); H01R 13/6588 (2011.01); H01R 13/6583 (2011.01); H01R 13/6585 (2011.01); H01R 13/6582 (2011.01); H01R 43/24 (2006.01); H01R 12/71 (2011.01); H01R 13/20 (2006.01); H01R 13/504 (2006.01); H01R 13/6461 (2011.01); H01R 13/6584 (2011.01); H05K 3/30 (2006.01); H01R 13/02 (2006.01); H05K 3/34 (2006.01); H01R 13/6474 (2011.01); H01R 13/502 (2006.01); H01R 13/46 (2006.01); H01R 13/646 (2011.01); H01R 13/6473 (2011.01); H01R 13/6581 (2011.01);
U.S. Cl.
CPC ...
H01R 13/6471 (2013.01); H01R 12/585 (2013.01); H01R 12/716 (2013.01); H01R 12/724 (2013.01); H01R 13/02 (2013.01); H01R 13/20 (2013.01); H01R 13/40 (2013.01); H01R 13/504 (2013.01); H01R 13/514 (2013.01); H01R 13/518 (2013.01); H01R 13/6461 (2013.01); H01R 13/6582 (2013.01); H01R 13/6583 (2013.01); H01R 13/6584 (2013.01); H01R 13/6585 (2013.01); H01R 13/6586 (2013.01); H01R 13/6587 (2013.01); H01R 13/6588 (2013.01); H01R 13/6591 (2013.01); H01R 43/24 (2013.01); H05K 1/115 (2013.01); H05K 3/306 (2013.01); H05K 3/3447 (2013.01); H01R 12/71 (2013.01); H01R 12/712 (2013.01); H01R 12/722 (2013.01); H01R 13/46 (2013.01); H01R 13/502 (2013.01); H01R 13/646 (2013.01); H01R 13/6473 (2013.01); H01R 13/6474 (2013.01); H01R 13/6581 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/1078 (2013.01); H05K 2201/10189 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10871 (2013.01);
Abstract

A backplane connector includes a number of wafers and a spacer for assembling the number of wafers together. Each wafer includes an insulating frame. The insulating frame includes a first protrusion. The spacer includes a body portion. The body portion has a number of slots for holding the first protrusions of the wafers. A periphery of each slot is surrounded by the body portion. Compared with the prior art, the spacer of the present disclosure is provided with a number of slots for holding the first protrusions of the wafers. As a result, the wafers can be easily assembled and fixed as a whole.

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