The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Dec. 08, 2021
Applicant:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Inventors:

Jooyong Park, Hwaseong-si, KR;

Chanho Kim, Seoul, KR;

Daeseok Byeon, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/18 (2023.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/08145 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/14511 (2013.01);
Abstract

A memory device includes first and second chips. The first chip includes a memory cell array disposed on a first substrate, and first metal pads on a first uppermost metal layer of the first chip. The second chip includes peripheral circuits disposed on a second substrate, and second metal pads on a second uppermost metal layer of the second chip, the peripheral circuits operating the memory cell array. A first metal pad and a second metal pad are connected in a first area, the first metal pads being connected to the memory cell array and the second metal pad being connected to the peripheral circuits. A further first metal pad and a further second metal pad are connected in a second area, the further first metal pad being not connected to the memory cell array and the further second metal pad being connected to the peripheral circuits.


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