The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 11, 2023
Filed:
Nov. 05, 2020
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Eng Huat Goh, Pulau Pinang, MY;
Tin Poay Chuah, Pulau Pinang, MY;
Yew San Lim, Pulau Pinang, MY;
Min Suet Lim, Pulau Pinang, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H05K 1/0209 (2013.01); H05K 3/284 (2013.01);
Abstract
According to the various aspects, the present device includes a printed circuit board having a top surface and a bottom surface, with a plurality of semiconductor devices coupled to the top surface and a flexible electromagnetic shield wrap conformally positioned over and between the plurality of semiconductor devices and the top surface of the printed circuit board. The flexible electromagnetic shield wrap is conformally positioned by applying a vacuum and is removable after the vacuum seal is broken.