The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Jan. 20, 2021
Applicant:

Alpha Assembly Solutions Inc., South Plainfield, NJ (US);

Inventors:

Monnir Boureghda, East Stroudsburg, PA (US);

Nitin Desai, Princeton Junction, NJ (US);

Anna Lifton, Bridgewater, NJ (US);

Oscar Khaselev, Monmouth Junction, NJ (US);

Michael T. Marczi, Chester, NJ (US);

Bawa Singh, Voorhees, NJ (US);

Assignee:

ALPHA ASSEMBLY SOLUTIONS INC., South Plainfield, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 13/0465 (2013.01); H01L 2224/2936 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/203 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49133 (2015.01); Y10T 29/49155 (2015.01); Y10T 428/24893 (2015.01);
Abstract

Methods for attachment and devices produced using such methods are disclosed. In certain examples, the method comprises disposing a capped nanomaterial on a substrate, disposing a die on the disposed capped nanomaterial, drying the disposed capped nanomaterial and the disposed die, and sintering the dried disposed die and the dried capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate. Devices produced using the methods are also described.


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