The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Nov. 11, 2021
Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventors:

Keiichi Takemoto, Nagano, JP;

Yoichi Harayama, Nagano, JP;

Hiroyuki Asakawa, Nagano, JP;

Takahiro Rokugawa, Nagano, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01T 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/67248 (2013.01); H01L 21/68757 (2013.01);
Abstract

A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force. The electrostatic chuck includes: an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate; a first heating layer that is formed on the adsorption layer and that includes a first electrode; a second heating layer that is formed on the first heating layer and that includes a second electrode; and a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other. The via includes a body portion, and an end portion that is connected to the body portion. A diameter of the end portion is larger than that of the body portion.


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