The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Jan. 29, 2021
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventor:

William A. Lendvay, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 13/16 (2006.01); G06F 13/42 (2006.01); G11C 11/00 (2006.01);
U.S. Cl.
CPC ...
G06F 13/1668 (2013.01); G06F 13/4282 (2013.01); G11C 11/005 (2013.01);
Abstract

The present disclosure includes apparatuses and methods related to a data buffer in a non-volatile dual in-line memory module (NVDIMM). An example apparatus can include a data buffer couplable to a host, a first memory device (e.g., volatile memory), wherein the first memory device is coupled to the data buffer via a first bus, a second memory device (e.g., non-volatile memory), and a controller, wherein the controller is coupled to the data buffer via a second bus and wherein the controller is configured to cause a data transfer from first memory device to the second memory device via the data buffer and the second bus.


Find Patent Forward Citations

Lendvay, William. (2023). Memory module data buffer (U.S. Patent No. 11698870). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11698870

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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