The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 11, 2023

Filed:

Jan. 21, 2020
Applicant:

Ebara Corporation, Tokyo, JP;

Inventors:

Makoto Kashiwagi, Tokyo, JP;

Manao Hoshina, Tokyo, JP;

Assignee:

EBARA CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 49/12 (2006.01); B24B 41/06 (2012.01); B24B 41/00 (2006.01); B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
B24B 49/12 (2013.01); B24B 7/228 (2013.01); B24B 41/005 (2013.01); B24B 41/06 (2013.01);
Abstract

There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.


Find Patent Forward Citations

Kashiwagi, Makoto. (2023). Substrate processing apparatus and substrate processing method (U.S. Patent No. 11697184). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11697184

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…