The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Jul. 28, 2021
Applicant:

Ibiden Co., Ltd., Gifu, JP;

Inventors:

Haruhiko Morita, Ogaki, JP;

Hitoshi Miwa, Ogaki, JP;

Shinobu Kato, Ogaki, JP;

Toshihiko Yokomaku, Ogaki, JP;

Hisashi Kato, Ogaki, JP;

Takahisa Hirasawa, Ogaki, JP;

Tetsuya Muraki, Ogaki, JP;

Takayuki Furuno, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 3/26 (2006.01);
U.S. Cl.
CPC ...
H02K 3/26 (2013.01); H02K 2203/03 (2013.01);
Abstract

A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.


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