The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Jun. 24, 2021
Applicant:
Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;
Inventors:
Frank Fournel, Grenoble, FR;
Emilie Bourjot, Grenoble, FR;
Séverine Cheramy, Grenoble, FR;
Sylvain Maitrejean, Grenoble, FR;
Loic Sanchez, Grenoble, FR;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 23/00 (2006.01); B32B 38/00 (2006.01); B32B 38/18 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 24/97 (2013.01); B32B 38/00 (2013.01); B32B 38/18 (2013.01); H01L 21/67144 (2013.01); H01L 21/6836 (2013.01); H01L 2224/95085 (2013.01); H01L 2224/97 (2013.01);
Abstract
A method for transferring at least one chip, from a first support to a second support, includes forming, while the chip is assembled to the first support, an interlayer in the liquid state between, and in contact with, a front face of the chip and an assembly surface of a face of the second support and a solidification of the interlayer. Then, the chip is detached from the first support while maintaining the interlayer in the solid state.