The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Jan. 22, 2020
Applicant:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Inventors:
Jae Yoon Kim, Gyeonggi-do, KR;
Ji Hun Lee, Gyeonggi-do, KR;
Suresh Jayaraman, Gilbert, AZ (US);
David Hiner, Chandler, AZ (US);
Won Chul Do, Seoul, KR;
Jin Young Khim, Seoul, KR;
Ju Hong Shin, Seoul, KR;
Kye Ryung Kim, Incheon, KR;
Assignee:
Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); H01L 21/311 (2013.01); H01L 23/3107 (2013.01); H01L 23/5389 (2013.01); H01L 24/05 (2013.01); H01L 24/12 (2013.01); H01L 24/19 (2013.01); H01L 24/82 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05008 (2013.01); H01L 2224/12105 (2013.01);
Abstract
In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.