The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 04, 2023

Filed:

Nov. 12, 2021
Applicant:

Mpi Corporation, Hsinchu Hsiang, TW;

Inventors:

Volker Hansel, Coswig, DE;

Sebastian Giessmann, Dresden, DE;

Frank Fehrmann, Dresden, DE;

Chien-Hung Chen, Hsinchu Hsiang, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/02 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2891 (2013.01); G01R 31/2887 (2013.01); H01L 22/12 (2013.01);
Abstract

The semiconductor inspecting method includes following steps. First, a first position of a probe needle from above is defined by adopting a vision system of a semiconductor inspecting system. Then, a first relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system. Thereafter, a minimum change in position of the probe needle corresponding to the first position is recognized by adopting the vision system of the semiconductor inspecting system. Next, the first relative vertical movement is stopped by adopting the driving system of the semiconductor inspecting system.


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