The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2023
Filed:
Dec. 02, 2020
Applicant:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Inventors:
Yuya Hirayama, Tokyo, JP;
Takayo Kitajima, Tokyo, JP;
Kenichi Tomioka, Tokyo, JP;
Keisuke Kushida, Tokyo, JP;
Minoru Kakitani, Tokyo, JP;
Hiroshi Shimizu, Tokyo, JP;
Assignee:
RESONAC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01); C08L 33/08 (2006.01); B32B 15/20 (2006.01); H05K 1/03 (2006.01); B32B 15/08 (2006.01); C08F 20/12 (2006.01); C08L 101/00 (2006.01); C08F 220/18 (2006.01); C08J 3/11 (2006.01); C08L 33/06 (2006.01); C08L 33/10 (2006.01); C08L 33/12 (2006.01);
U.S. Cl.
CPC ...
B32B 15/20 (2013.01); B32B 15/08 (2013.01); C08F 20/12 (2013.01); C08F 220/1802 (2020.02); C08F 220/1804 (2020.02); C08J 3/11 (2013.01); C08J 5/244 (2021.05); C08L 33/06 (2013.01); C08L 33/08 (2013.01); C08L 101/00 (2013.01); H05K 1/0326 (2013.01); H05K 1/0353 (2013.01); H05K 1/0366 (2013.01); C08J 2300/24 (2013.01); C08J 2333/06 (2013.01); C08J 2333/08 (2013.01); C08J 2333/10 (2013.01); C08J 2463/00 (2013.01); C08L 2201/56 (2013.01);
Abstract
The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.