The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Jul. 13, 2020
Applicant:

Asml Netherlands B.v., Veldhoven, NL;

Assignee:

ASML Netherlands B.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/544 (2006.01); G06K 19/06 (2006.01); G06F 21/44 (2013.01); G09C 5/00 (2006.01); G06F 21/73 (2013.01); H04L 9/40 (2022.01); G06K 7/14 (2006.01); H01L 25/065 (2023.01); H04L 9/14 (2006.01); H04L 9/32 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); G06F 21/44 (2013.01); G06F 21/73 (2013.01); G06K 7/1417 (2013.01); G06K 19/06037 (2013.01); G06K 19/06178 (2013.01); G09C 5/00 (2013.01); H01L 25/0652 (2013.01); H04L 9/14 (2013.01); H04L 9/3271 (2013.01); H04L 63/08 (2013.01); G06F 2221/2103 (2013.01); H01L 2223/5444 (2013.01); H01L 2223/54413 (2013.01); H01L 2223/54433 (2013.01);
Abstract

An electronic device comprising a semiconductor chip which comprises a plurality of structures formed in the semiconductor chip, wherein the semiconductor chip is a member of a set of semiconductor chips, the set of semiconductor chips comprises a plurality of subsets of semiconductor chips, and the semiconductor chip is a member of only one of the subsets. The plurality of structures of the semiconductor chip includes a set of common structures which is the same for all of the semiconductor chips of the set, and a set of non-common structures, wherein the non-common structures of the semiconductor chip of the subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a first portion of the non-common structures and a first portion of the common structures form a first non-common circuit, wherein the first non-common circuit of the semiconductor chips of each subset is different from a non-common circuit of the semiconductor chips in every other subset. At least a second portion of the non-common structures is adapted to store or generate a first predetermined value which uniquely identifies the first non-common circuit, wherein the first predetermined value is readable from outside the semiconductor chip by automated reading means.


Find Patent Forward Citations

Loading…