The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

May. 07, 2021
Applicant:

Wolfspeed, Inc., Durham, NC (US);

Inventors:

Marvin Marbell, Cary, NC (US);

Arthur Pun, Raleigh, NC (US);

Jeremy Fisher, Raleigh, NC (US);

Ulf Andre, Hillsborough, NC (US);

Alexander Komposch, Morgan Hill, CA (US);

Assignee:

WOLFSPEED, INC., Durham, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/66 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6644 (2013.01);
Abstract

An RF transistor package includes a metal submount; a transistor die mounted to the metal submount; and a surface mount IPD component mounted to the metal submount. The surface mount IPD component includes a dielectric substrate that includes a top surface and a bottom surface and at least a first pad and a second pad arranged on a top surface of the surface mount IPD component; at least one surface mount device includes a first terminal and a second terminal, the first terminal of the surface mount device mounted to the first pad and the second terminal mounted to the second pad; at least one of the first terminal and the second terminal being configured to be isolated from the metal submount by the dielectric substrate; and at least one wire bond bonded to the at least one of the first pad and the second pad.


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