The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Apr. 28, 2021
Applicant:

Kla Corporation, Milpitas, CA (US);

Inventors:

Farhat A. Quli, Castro Valley, CA (US);

Razieh Mahzoon, Hawyard, CA (US);

Ran Liu, Fremont, CA (US);

Assignee:

KLA Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 22/12 (2013.01);
Abstract

A process condition sensing apparatus is disclosed. The apparatus includes a substrate and an electronic enclosure including one or more electronic components. The apparatus includes a floating connection assembly configured to mechanically couple the electronic enclosure to the substrate, the floating connection assembly includes a leg and a foot. The leg or foot are arranged to mitigate thermal stress between one or more interfaces. The one or more interfaces include a leg-enclosure interface or a foot-substrate interface.


Find Patent Forward Citations

Quli, Farhat. (2023). Mitigating thermal expansion mismatch in temperature probe construction apparatus and method (U.S. Patent No. 11688614). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11688614

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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