The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 27, 2023

Filed:

Jan. 05, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Jun Xu, Shanghai, CN;

Yingda Dong, Los Altos, CA (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 16/34 (2006.01); G11C 16/26 (2006.01); G11C 16/10 (2006.01); G11C 11/56 (2006.01); G11C 16/04 (2006.01);
U.S. Cl.
CPC ...
G11C 16/3459 (2013.01); G11C 11/5628 (2013.01); G11C 11/5642 (2013.01); G11C 11/5671 (2013.01); G11C 16/0483 (2013.01); G11C 16/10 (2013.01); G11C 16/26 (2013.01); G11C 2211/5621 (2013.01);
Abstract

A device might include a common source, a three-dimensional array of memory cells, a plurality of access lines, and a controller. The three-dimensional array of memory cells might include a plurality of NAND strings. Each NAND string might be selectively connected between a corresponding data line and the common source. Each access line of the plurality of access lines might be connected to a control gate of a respective memory cell of each NAND string of the plurality of NAND strings. The controller might be configured to access the three-dimensional array of memory cells to implement a source-side seeding operation.


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