The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 2023
Filed:
Jan. 04, 2022
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Hsien-Hsin Sean Lee, Duluth, GA (US);
William Wu Shen, Hsinchu, TW;
Yun-Han Lee, Hsinchu County, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
A memory circuit includes a stack of first dies including multiple sets of memory cells of a first type, a second die including multiple sets of memory cells of a second type, a third die, and an interposer carrying the first, second, and third dies. The second die includes a first set of input/output (I/O) terminals on a top surface of the second die and a second set of I/O terminals on a bottom surface of the second die. The stack of first dies is coupled to the second die through the first set of I/O terminals. The interposer is coupled to the second die through the second set of I/O terminals. The third die is positioned aside the second die and in communication with the second die through the interposer.