The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 20, 2023

Filed:

Dec. 14, 2021
Applicants:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Semiconductor Manufacturing International (Beijing) Corporation, Beijing, CN;

Inventors:

Jian Qiang Liu, Beijing, CN;

Chao Tian, Beijing, CN;

Zi Rui Liu, Beijing, CN;

Ching Yun Chang, Beijing, CN;

Ai Ji Wang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 21/8234 (2006.01); H01L 21/28 (2006.01); H01L 27/092 (2006.01); H01L 21/283 (2006.01);
U.S. Cl.
CPC ...
H01L 21/82345 (2013.01); H01L 21/28088 (2013.01); H01L 27/092 (2013.01); H01L 29/4966 (2013.01);
Abstract

A semiconductor structure is provided. The semiconductor structure includes: a base substrate having an opening; and a first gate layer formed in the opening. In the first gate layer closes a top of the opening and the first gate layer includes at least one void. The semiconductor structure further includes a second gate layer formed on the first gate layer. An atomic radius of the material of the second gate layer is smaller than gaps among atoms of the material of the first gate layer and the void is filled by atoms of one of the material of the first gate layer and the material of the second gate layer.


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