The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Dec. 24, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Olaotan Elenitoba-Johnson, Tigard, OR (US);
Mark Hemmeyer, Hillsboro, OR (US);
Mengqi Liu, Hillsboro, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 5/00 (2006.01); H05K 7/20 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 5/006 (2013.01); H05K 1/0209 (2013.01); H05K 7/20154 (2013.01);
Abstract
Examples described herein relate to a tool-less manner of forming an assembly with a circuit board carrier enclosure that provide leaf springs that provide a force against a circuit board to maintain a level surface of the circuit board. Multiple leaf springs can be used to apply a desired force to the circuit board. A heat sink can be mounted in the enclosure at a distance from the circuit board. The circuit board with carrier can be inserted without tools into an electrical connection for communications with other devices.