The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Feb. 25, 2022
Applicant:
Macronix International Co., Ltd., Hsinchu, TW;
Inventors:
Assignee:
MACRONIX INTERNATIONAL CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H05K 3/34 (2006.01); H05K 3/24 (2006.01); H05K 3/18 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/384 (2013.01); H05K 1/00 (2013.01); H05K 3/188 (2013.01); H05K 3/241 (2013.01); H05K 3/3452 (2013.01);
Abstract
A circuit board includes a substrate, a plurality of contacts disposed on a surface of the substrate, and a solder mask. The contacts have a plurality of plating regions and a metal layer on the plating regions, and the plating regions have at least two different sizes. The solder mask covers the surface of the substrate and covers edges of the plating regions, in which topmost surfaces of the contacts are below a top surface of the solder mask, and a gap between the topmost surfaces of the contacts and the top surface of the solder mask is larger than 0 μm and is smaller than 5 μm.