The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Jun. 22, 2015
Applicant:

Rensselaer Polytechnic Institute, Troy, NY (US);

Inventors:

Rajendra P. Dahal, Troy, NY (US);

Ishwara B. Bhat, Clifton Park, NY (US);

Yaron Danon, Selkirk, NY (US);

James Jian-Qiang Lu, Watervliet, NY (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/115 (2006.01); H01L 31/0304 (2006.01); H01L 21/02 (2006.01); H01L 31/18 (2006.01); H01L 31/0384 (2006.01);
U.S. Cl.
CPC ...
H01L 31/115 (2013.01); H01L 21/0243 (2013.01); H01L 21/0254 (2013.01); H01L 21/0262 (2013.01); H01L 21/02433 (2013.01); H01L 21/02458 (2013.01); H01L 21/02562 (2013.01); H01L 31/03044 (2013.01); H01L 31/0384 (2013.01); H01L 31/184 (2013.01); H01L 31/1856 (2013.01); Y02E 10/544 (2013.01);
Abstract

Radiation detecting-structures and fabrications methods thereof are presented. The methods include, for instance: providing a substrate, the substrate including at least one trench extending into the substrate from an upper surface thereof; and epitaxially forming a radiation-responsive semiconductor material layer from one or more sidewalls of the at least one trench of the substrate, the radiation-responsive semiconductor material layer responding to incident radiation by generating charge carriers therein. In one embodiment, the sidewalls of the at least one trench of the substrate include a (111) surface of the substrate, which facilitates epitaxially forming the radiation-responsive semiconductor material layer. In another embodiment, the radiation-responsive semiconductor material layer includes hexagonal boron nitride, and the epitaxially forming includes providing the hexagonal boron nitride with an a-axis aligned parallel to the sidewalls of the trench.


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