The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Sep. 22, 2020
Applicant:
Amkor Technology Singapore Holding Pte. Ltd., Valley Point, SG;
Inventors:
David Hiner, Chandler, AZ (US);
Michael Kelly, Queen Creek, AZ (US);
Ronald Huemoeller, Gilbert, AZ (US);
In Su Mok, Gyeonggi-do, KR;
Sang Hyoun Lee, Incheon, KR;
Won Chul Do, Seoul, KR;
Jin Young Khim, Seoul, KR;
Assignee:
AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0655 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/3185 (2013.01); H01L 23/5383 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 24/97 (2013.01); H01L 25/50 (2013.01); H01L 21/486 (2013.01); H01L 23/49816 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/18 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/97 (2013.01);
Abstract
A semiconductor package structure and a method for making a semiconductor package. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for making thereof, that comprise a connect die that routes electrical signals between a plurality of other semiconductor die.