The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Aug. 30, 2019
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Ziyin Lin, Chandler, AZ (US);
Elizabeth Nofen, Phoenix, AZ (US);
Vipul Mehta, Chandler, AZ (US);
Taylor Gaines, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3178 (2013.01); H01L 21/565 (2013.01); H01L 21/67288 (2013.01); H01L 23/367 (2013.01); H01L 23/373 (2013.01);
Abstract
A device is disclosed. The device includes a first die, a plurality of chiplets above the first die, a first underfill material beneath the chiplets, and a gap fill material between the chiplets. The gap fill material is different from the first underfill material. An interface region is formed between the first underfill material and the gap fill material.