The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2023
Filed:
Jun. 29, 2021
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Samuel E. Gottheim, Santa Clara, CA (US);
Eswaranand Venkatasubramanian, Santa Clara, CA (US);
Pramit Manna, Sunnyvale, CA (US);
Abhijit Basu Mallick, Palo Alto, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/762 (2006.01); H01J 37/32 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76837 (2013.01); H01J 37/32183 (2013.01); H01J 37/32449 (2013.01); H01J 37/32522 (2013.01); H01J 37/32568 (2013.01); H01L 21/0217 (2013.01); H01L 21/02115 (2013.01); H01L 21/02164 (2013.01); H01L 21/67248 (2013.01); H01L 21/6833 (2013.01); H01L 21/76224 (2013.01); H01J 2237/3321 (2013.01);
Abstract
Embodiments of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein provide techniques for deposition of high quality gapfill. Some embodiments utilize chemical vapor deposition, plasma vapor deposition, physical vapor deposition and combinations thereof to deposit the gapfill. The gapfill is of high quality and similar in properties to similarly composed bulk materials.