The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 13, 2023

Filed:

Oct. 18, 2021
Applicant:

Sifive, Inc., San Mateo, CA (US);

Inventors:

Megan Wachs, San Francisco, CA (US);

Henry Cook, Berkeley, CA (US);

Wesley Waylon Terpstra, San Mateo, CA (US);

Assignee:

SiFive, Inc., San Mateo, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/398 (2020.01); G06F 30/333 (2020.01);
U.S. Cl.
CPC ...
G06F 30/398 (2020.01); G06F 30/333 (2020.01);
Abstract

Systems and methods are disclosed for generation and testing of integrated circuit designs with point-to-point connections between modules. These may allow for the rapid design and testing (e.g. silicon testing) of processors and SoCs. For example, type parameterization may be used to generate point-to-point connections in a flexible manner. For example, a point-to-point connection between the source module and the sink module that includes one or more named wires specified by bundle type may be automatically generated based on using the bundle type as a type parameterization input. For example, these system and methods may be used to rapidly connect a custom processor design, including one or more IP cores, to a standard input/output shell for a SoC design to facilitate rapid silicon testing of the custom processor design.


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