The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Jul. 03, 2020
Applicant:
Ap Memory Technology Corporation, Hsinchu County, TW;
Inventors:
Wenliang Chen, Hsinchu County, TW;
Lin Ma, Hsinchu County, TW;
Assignee:
AP MEMORY TECHNOLOGY CORPORATION, Hsinchu County, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 27/108 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10805 (2013.01); H01L 23/49513 (2013.01); H01L 23/5226 (2013.01); H01L 24/06 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 27/10844 (2013.01);
Abstract
A semiconductor structure is provided. The semiconductor structure includes a first hybrid bonding structure, a memory structure, and a control circuit structure. The first hybrid bonding layer includes a first surface and a second surface. The memory structure is in contact with the first surface. The control circuit structure is configured to control the memory structure. The control circuit structure is in contact with the second surface. A system in package (SiP) structure and a method for manufacturing a plurality of semiconductor structures are also provided.