The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

May. 21, 2021
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Shao-En Hsu, Kaohsiung, TW;

Huei-Shyong Cho, Kaohsiung, TW;

Shih-Wen Lu, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H01Q 1/24 (2006.01); H01Q 21/06 (2006.01); H01Q 1/22 (2006.01); H01Q 1/48 (2006.01); H01Q 5/378 (2015.01);
U.S. Cl.
CPC ...
H01Q 1/523 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 5/378 (2015.01); H01Q 21/061 (2013.01);
Abstract

A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.


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