The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Dec. 17, 2020
Applicant:
Utac Headquarters Pte. Ltd., Singapore, SG;
Inventors:
Dzafir Bin Mohd Shariff, Singapore, SG;
Enrique Jr Sarile, Singapore, SG;
Seung Geun Park, Singapore, SG;
Assignee:
UTAC Headquarters Pte Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/544 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/76838 (2013.01); H01L 23/544 (2013.01);
Abstract
A semiconductor package which is free of metal debris from backside metallization (BSM) is disclosed. The semiconductor package is singulated by performing a saw street open process from the frontside of the wafer and then includes a singulation process using a plasma etch from the backside of the wafer with BSM. The singulation process results in metal debris free packages.