The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 2023
Filed:
Nov. 27, 2019
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventor:
Shigeru Kasai, Nirasaki, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G01N 25/18 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01N 25/18 (2013.01); H01L 23/345 (2013.01); H01L 23/36 (2013.01); H01L 24/80 (2013.01); H01L 2224/80009 (2013.01); H01L 2224/80895 (2013.01);
Abstract
A test wafer according to an embodiment of the present disclosure is a test wafer used for simulation of heat emission of devices on a wafer, and includes a silicon wafer and a silicon heater bonded to a surface of the silicon wafer.