The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

Jan. 30, 2019
Applicants:

Sumitomo Electric Industries, Ltd., Osaka, JP;

A.l.m.t. Corp., Tokyo, JP;

Inventors:

Kengo Goto, Osaka, JP;

Tomoaki Ikeda, Osaka, JP;

Akihisa Hosoe, Osaka, JP;

Masanori Sugisawa, Sakata, JP;

Fukuto Ishikawa, Sakata, JP;

Hideaki Morigami, Toyama, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); C23C 18/18 (2006.01); C23C 26/00 (2006.01); C23C 18/50 (2006.01); C22C 26/00 (2006.01); B32B 15/04 (2006.01); H01L 23/373 (2006.01); C22C 1/04 (2023.01); C22C 1/05 (2023.01); C22C 5/06 (2006.01); C23C 18/32 (2006.01); H01L 21/48 (2006.01); B32B 19/00 (2006.01); B32B 15/16 (2006.01); B32B 19/04 (2006.01); B22F 7/02 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1651 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/16 (2013.01); B32B 19/00 (2013.01); B32B 19/041 (2013.01); C22C 1/0466 (2013.01); C22C 1/05 (2013.01); C22C 5/06 (2013.01); C22C 26/00 (2013.01); C23C 18/1637 (2013.01); C23C 18/1803 (2013.01); C23C 18/1827 (2013.01); C23C 18/1844 (2013.01); C23C 18/1879 (2013.01); C23C 18/32 (2013.01); C23C 18/50 (2013.01); H01L 21/4871 (2013.01); H01L 23/3732 (2013.01); H01L 23/3736 (2013.01); B22F 7/02 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2255/28 (2013.01); Y10T 428/12493 (2015.01); Y10T 428/12535 (2015.01); Y10T 428/12625 (2015.01); Y10T 428/12868 (2015.01); Y10T 428/12875 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/12993 (2015.01);
Abstract

A composite member includes: a substrate formed of a composite material containing a plurality of diamond grains and a metal phase; and a coating layer made of metal. The surface of the substrate includes a surface of the metal phase, and a protrusion formed of a part of at least one diamond grain of the diamond grains and protruding from the surface of the metal phase. In a plan view, the coating layer includes a metal coating portion, and a grain coating portion. A ratio of a thickness of the grain coating portion to a thickness of the metal coating portion is equal to or less than 0.80. The coating layer has a surface roughness as an arithmetic mean roughness Ra of less than 2.0 μm.


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