The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 06, 2023

Filed:

May. 28, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Tsung-Lin Lee, Tainan, TW;

Yi-Ming Lin, Tainan, TW;

Chih-Hung Yeh, Tainan, TW;

Zi-Yuang Wang, New Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/00 (2006.01); B08B 3/08 (2006.01); B08B 9/08 (2006.01); H01J 37/32 (2006.01); C23C 16/44 (2006.01); C23C 16/22 (2006.01); B05D 1/00 (2006.01); C23C 14/06 (2006.01);
U.S. Cl.
CPC ...
B08B 3/08 (2013.01); B05D 1/60 (2013.01); B08B 9/08 (2013.01); C23C 14/06 (2013.01); C23C 16/00 (2013.01); C23C 16/22 (2013.01); C23C 16/4405 (2013.01); H01J 37/32862 (2013.01); C23C 16/4404 (2013.01);
Abstract

A method of forming a process film includes the following operations. A substrate is transferred into a process chamber having an interior surface. A process film is formed over the substrate, and the process film is also formed on the interior surface of the process chamber. The substrate is transferred out of the process chamber. A non-process film is formed on the interior surface of the process chamber. In some embodiments, porosity of the process film is greater than a porosity of the non-process film.


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