The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2023
Filed:
Jun. 23, 2022
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventor:
Ming Hsien Tsai, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 7/01 (2006.01); H01L 23/522 (2006.01); H01F 17/00 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 49/02 (2006.01); H03H 7/09 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H03H 7/0115 (2013.01); H01L 23/528 (2013.01); H01L 23/5223 (2013.01); H01L 23/5227 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 28/10 (2013.01); H01L 28/40 (2013.01); H03H 7/09 (2013.01); H01F 2017/0026 (2013.01); H01L 23/5286 (2013.01); H01L 2224/13116 (2013.01); H03H 2001/0078 (2013.01); H03H 2001/0085 (2013.01); H03H 2007/013 (2013.01);
Abstract
A filter structure includes a ground plane in a first metal layer of an integrated circuit (IC) package, a plate in a second metal layer of the IC package, a dielectric layer between the ground plane and the plate, the ground plane, the dielectric layer, and the plate thereby being configured as a capacitive device, and an inductive device in a third metal layer of the IC package. The inductive device is electrically connected to the plate, and the plate and the inductive device are configured to have a resonance frequency greater than 1 GHz.