The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Oct. 05, 2018
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Marco Gavagnin, Leoben, AT;
Jonathan Silvano de Sousa, Vienna, AT;
Assignee:
AT&S Austria Technologie & Systemtechnik AG, Leoben, AT;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H05K 1/18 (2006.01); B22F 7/08 (2006.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); H05K 3/12 (2006.01); B22F 10/20 (2021.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); B22F 7/08 (2013.01); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); H05K 1/021 (2013.01); H05K 1/0209 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 3/1241 (2013.01); H05K 3/4644 (2013.01); H05K 3/4664 (2013.01); B22F 10/20 (2021.01); H05K 2201/064 (2013.01); H05K 2201/066 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/0195 (2013.01); H05K 2203/107 (2013.01);
Abstract
A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.