The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Dec. 21, 2020
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Hong Bok We, San Diego, CA (US);

Aniket Patil, San Diego, CA (US);

Jeahyeong Han, San Diego, CA (US);

Mohammad Ali Tassoudji, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/52 (2006.01); H01Q 21/00 (2006.01); H01Q 23/00 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01Q 1/526 (2013.01); H01Q 21/0087 (2013.01); H01L 2223/6677 (2013.01); H01Q 23/00 (2013.01);
Abstract

Aspects disclosed herein include a device including a first antenna substrate including one or more antennas. The device also includes a metallization structure. The device also includes a first spacer disposed between the first antenna substrate and the metallization structure, configured to maintain a constant distance between the first antenna substrate and the metallization structure. The device also includes a first plurality of conductive elements, disposed within the first spacer, configured to electrically couple the first antenna substrate to the metallization structure. The device also includes where the first spacer is configured to enclose all the conductive elements, electrically coupled to the first antenna substrate, and is configured to form an air gap between the first antenna substrate and the metallization structure. The device also includes where the first plurality of conductive elements is separated by air in the air gap.


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