The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 2023

Filed:

Jan. 06, 2022
Applicant:

United Microelectronics Corp., Hsinchu, TW;

Inventors:

Pei-Lun Jheng, Tainan, TW;

Chao-Sheng Cheng, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/49 (2006.01); H01L 29/423 (2006.01); H01L 21/8234 (2006.01); H01L 29/45 (2006.01); H01L 27/088 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4933 (2013.01); H01L 21/82345 (2013.01); H01L 21/823443 (2013.01); H01L 27/088 (2013.01); H01L 29/42372 (2013.01); H01L 29/456 (2013.01);
Abstract

A method for manufacturing a semiconductor structure is provided. The method comprises the following steps. A first silicon-containing gate electrode is formed on a semiconductor substrate in a first region. A second silicon-containing gate electrode is formed on the semiconductor substrate in a second region. A gate silicide element is formed on an upper surface of the first silicon-containing gate electrode. A source silicide element and a drain silicide element are formed on the semiconductor substrate on opposing sides of the second silicon-containing gate electrode respectively. The gate silicide element, the source silicide element and the drain silicide element are formed simultaneously.


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